Packaging/Substrate Technical Marketing Engineer (Closed)
| Job Title: | Packaging/Substrate Technical Marketing Engineer (Closed) |
| Our Client: | A Leading Manufacturer of key electronic components |
| Country: | United States |
| Location: | San Jose, CA |
| Specialisation: | Manufacturing & Engineering |
| Salary: | $100,000-$200,000 |
| Job Reference: | 4996 |
| Contact Person: | Brandon K. PARK Senior Director |
| Contact Email: | brandon.park@cesna.com |
| Job Published: | 2023-09-28 |
Position
Packaging/Substrate Technical Marketing Engineer, bilingual English/Korean)
About Our Client
Global leader in the semiconductor industry, specialized in the development, manufacturing and distribution of passive electronic components.
Job Summary
- Our client is a leading player in the world of Organic Substrates to provide solutions to the PC Client, Data Centers, Gaming, Memories, Automotive and other consumer electronics customers. Two years ago, this industry witnessed an inflection point with the growth of complexity of substrates in its size and interconnection density. Now with the rise of AI/ML application, the substrate industry is seeing a shift in customers engagement from the prototyping/manufacturing stage to early engagement during the pre-silicon design stage.
- The company is looking for a technology leader with the experience in business development in the Semiconductor industry to lead its efforts to provide its customers, the best in class Customer experience and the cutting-edge solution by engaging with them at the silicon architecture stage till the high-volume ramp. This technology leader will be working at our San Jose, CA office reporting to a senior leadership executive.
Job Description
- - Well understand Semiconductor design and packaging technologies with the sufficient knowledge of Substrates.
- - Be conversant with the types of memories including HBMs and chip to chip interconnections such as various generations of PCIe, UCIe etc.
- - Be knowledgeable of the working style of key end customers who are designing silicon (including both Semiconductor companies and System companies) for Data Centers including AI and ML.
- - Have a flare to build relationship with customer’s key technical members.
- - Be able to effectively communicate with engineers in Headquarter and drive milestones, action items, customers quality issues.
- - Work closely with engineers in Headquarter, absorb technical advantages and limitations and then create Customer Value Proposition material for business development.
Qualifications
- - Minimum Bachelor’s Degree in Manufacturing, Engineering, Packaging or equivalent work experience with evidence of exceptional ability. PhD preferred.
- - 5+ years of substrate engineering experience and 5+ years of packaging engineering experience
- - Must have excellent written and verbal communication skills in Korean/English
- - Demonstrated experience in successful customer and team relationships
- - Self-starter with analytical and business acumen
- - Excellent teamwork skills
- - Must be able to travel about 25% + of the time
What's On Offer
Competitive base salary + benefits and bonus
Apply online or feel free to contact us directly for more information about the opportunity. Due to the high volume of applicant, we regret to inform that only shortlisted candidates will be notified. Thank you for your understanding.
Apply Now
